Print- services
- project
- MEMS design and Analysis
- Silicon and Polymer based Micro device / MEMs fabrication
- Signal conditioning circuit design for MEMS
- Characterization and Packaging of Micro-systems
- Inspection and testing of Packaged Micro-devices
- Internship and M.Tech Projects
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- Design and Development of Thin film based Temperature Sensor for Industrial and Defence applications
- Thermal based Micro-flow Sensor for drug delivery application
- Polymer device Development using Nano Imprint Lithography (NIL) process: Nano-gratings, Micro-needle array and micro-lens array , Micro fluidic channels, Micro Pillars
- Electron beam welding (EBW) Process Development
- Advanced packaging of RF MEMS switch: Carrier wafer Fabrication for RF switches using gold electroplating and photo-lithography
- Thermo-compression wafer bonding for advanced micro-system packaging:
- Silver wire bonding for micro-system Packaging.
- Technology establishment for Flip chip bonding
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