• Temperature Range: -40 to 1850C
• Humidity Range: 10 to 95% Rh
• Chamber Volume: 50 Lts
• Sample Load Capacity: 20 Kg
• Access Port: 4 inch opening with Silicone cork

• Temperature Range: -40 to 1850C
• Humidity Range: 10 to 95% Rh
• Chamber Volume: 50 Lts
• Sample Load Capacity: 20 Kg
• Access Port: 4 inch opening with Silicone cork

• Geometric Magnification = 2000x
• Can be detect down to 500nm

• Non destructive test of MEMS Packages
• Inspection of defects in Dies, Wafers
• Inspection of PCB defects and casting parts

• Smallest detectable leak rate of 5 x 10-12 mbar l/s.
• Automatic calibration of leak detector with standard fine leak (NIST certified)

• Fine leak inspection of hermetic sealing and qualification of seal.
• Bombing and vacuum inspection of sealed device, to qualify for MIL-STD-883 method 1014 for military and aero space applications.
• Sniffer inspection for fine leak detection

• Pull, push (10 kgf) and shear tests (100 kgf)
• Supports 80x magnification and fine pitch analysis

• Mechanical characterization of die attach process
• Mechanical characterization of wire bonding process

• 6” wafer inspection
• High resolution Micromanipulators – XYZ resolutions ≥ 80TPI

• Electrical inspection of 6” wafer – KGD and quality inspection
• Failure analysis of devices
• Probing of I/O pads on devices from Front End Of Line (FEOL) and Mid End Of Line (MEOL)

• Various reflected light options like Bright field, dark field, Polarization, Differential Interference Contrast (DIC) and Fluorescence.
• Transmitted light options like bright field and polarization for inspection of transparent specimen like glass and certain polymers

• Inspection, process control and defect analysis in MEMS packaging process
• Structural analysis of materials

• Liquid CO2 based
• Suitable for wafer sizes upto 6” and small dies.

• Drying of MEMS released structures.
• Drying of high aspect ratio micro structures.Sample preparation for SEM

• 6kW, 60kV electron beam gun.
• Twin gun configuration with horizontal gun to avoid sagging of long cylindrical jobs during welding

• Vacuum hermetic sealing of microelectronic components.
• Military and aerospace applications where reliability of the system is important, Hermetic sealed micro electronics is essential.
• Micro joining and macro joining of dissimilar materials

• Resistive welding of different package size ranges from 3mm to 150mm.
• Multiple packages seam sealing in one fixture

• N2 based hermetic seam sealing of micro electronics.
• Military and aerospace applications where reliability of the system is important, Hermetic sealed micro electronics is essential

• Semi-automatic wire bonder
• Performs Ball-wedge, wedge-wedge and deep access bonding
• Capable of Copper bonding

• Au, Al, Cu wire bonding for MEMS
• Gold ball bumping
• Copper bonding

• Wafer bonding of two or more wafers of size
• upto 6” and small dies.
• Suitable for Thermo-compression, Anodic,
• Fusion, Glass frit and Adhesive bonding
• Bonding force: upto 20 kN
• Temperature: upto 500°C with ± 2%
• Uniformity

• Manufacturing of MEMS sensors
• Wafer level Packaging of MEMS sensors
• 3D packaging of MEMS+ASIC

• • Thermo compression, reflow, eutectic, epoxy and Thermo sonic bonding capability​
  • Formic acid vapor tool configuration

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• Autocollimator & Advanced Laser leveling system​
• Fragile material compatibility
• Temperature up to 450 degree C​
• Force range up to 100 kg​
• Fine pitch bonding of 15 µm achieved

• Multi chip modules
• Wireless multi stack chip bonding

• Sub-merged dicing for released structures
• Can dice 6 inch wafer

• Dicing of released MEMS sensors
• Dicing of wafers and smaller dies

• Programmable process control 0 to 300 W,
• wide range RF power supply

• Surface preparation for wire bonding and die attach process
• Contamination removal in the MEMS packaging process

• NPP and SS perforated top with Laminar flow

• Cleaning of Wafers/ die/ samples using different process.
• Etching of different materials.
• Photo-resist coating and its development
• Wafer cleaning and chemical processing

• 10 kW and 6 kW Twin gun configuration for co-evaporation.
• Chamber vacuum of up to 3×10-7 mbar
• Suitable for single wafer handling up to 6“
• Equipped with a grid less ion source and effusion cell
• Load lock and variable source to substrate distance from 500-700 mm
• Substrate heating up to 600 oC and max 30 rpm substrate rotation

• Intermediate metal layer deposition in 3D packaging
• Optical coatings
• Insulating dielectrics deposition in fabrication and stacking approach

• 6″ Wafer Processing
• Manual Wafer Loading, Automated Robot Transfer To Load-lock Chamber
• ESC With Active Wafer Temperature Control (Helium Backside Cooling)
• High-speed Gas Line System For Improved Response And Smoother Sidewalls
• Notch Prevention Package For SOI Applications

• TSV formation for Advanced Micro-system Packaging
• High Aspect Ratio Micro-structures

• Electroplating Station designed for MEMS/NANO and High density Interconnects.
• Dedicated Cu & Gold Plating Tanks. Suitable
  to deposit any metal or alloy from aqueous solution.
• Suitable for deposition on small sized dies (20mm X 20mm) and wafers upto 6″ Wafers
• Deposition Uniformity :>5% across the wafer

• Gold, Copper Electroplating for MEMS devices
• Electrodes metallization

• Individually temperature controlled heaters with max 450oC.
• 20 KN force achieved with high degree of uniformity of pressure distribution.
• Pattern size up to 50nm

• Polymer Micro needle array
• Polymer Micro fluidic channel
• Polymer Micro lens array

• Wafer thickness ranging from 0.1 to 10mm can be handled upto to 6″ diameter.
• Can achieve feature size up to 50nm.

• Polymer Micro Optics
• Polymer Micro fluidic channel
• Polymer Micro lens array

• Wafer handling capacity: upto 6 inch

• Spin coating of Photo resists, Polymers, Anti sticking coatings (ASL), Adhesives, Promoters

• Handles wafers upto 6 inch
• Alignment accuracy = ± 1µm
• Performs bond alignment

• photolithography for fabrication of MEMS devices
• Master mold creation for Nano Imprint Lithography