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Experience of 6 years in CMTI.
Prior 1 year experience in Infosys as Software Engineer Trainee.
Research areas include Embedded Systems, ASIC Design, MEMS Design, Fabrication & Packaging.
R & D Areas – Design & Development of Thermal Error Compensation for Machine Tools, Control System for High-Speed Shuttle-Less Rapier Loom, Signal Conditioning (Off-Shelf & ASIC) for MEMS Sensors, Design of MEMS Sensors for Machine Tool, Agriculture, Bio-Medical applications etc., 3D TSV’s & Advanced Packaging.
Paper/ Patent Published: Patent Pending for “System And Method For Real Time Thermal Error Compensation In Machine Tool using Temperature measurement”
M.Tech (VLSI Design & Embedded Systems) /B.E (Electronics and Communication Engineering)
Research areas include
Design & Development of Thermal Error Compensation for Machine Tools, Control System for High-Speed Shuttle-Less Rapier Loom, Signal Conditioning (Off-Shelf & ASIC) for MEMS Sensors, Design of MEMS Sensors for Machine Tool, Agriculture, Bio-Medical applications etc., 3D TSV’s & Advanced Packaging.
Patent Pending for “System And Method For Real Time Thermal Error Compensation In Machine Tool using Temperature measurement”