• Pursuing Ph. D. from CeNSE, IISc, Bangalore
• M. Tech (VLSI Design & CAD) from Thapar University, Patiala, India (2010)
• M. Sc. (Electronics) from Banasthali University, Banasthali, India (2008)
• B. Sc. from Jiwaji University, Gwalior, India (2006)

• Design and development of MEMS Sensor
• Wet etching and photo-lithography for MEMS fabrication
• Wafer bonding for MEMS fabrication and advanced micro-system integration.
• Thermal Mass flow Sensor
• Silicon Micromachining

• Development of MEMS based thermal mass flow controller (DST Funded)
• Development of Piezo-resistive position sensor with integrated tip for surface profile measurement ()
• Assessment for Silicon Photonics and Diamond chip manufacturing lines with Indian machinery and supply chain” (MeitY Funded)
• Development of Her2 indicator kit for breast cancer detection (In collaboration with NIT, Durgapur)
• Sensors and controls development for Ventilator applications.(CMTI Funded)
• IOT enabled Metal cutting Machine (Displayed at IMTEX-2019 )
• Establishment of Sensor technology development Facility (STDF) at CMTI equipped with world class MEMS Design, fabrication, characterization and packaging equipment (DHI Funded)
• Establishment of key process technologies for MEMS fabrication and advanced microsystem packaging mainly wafer bonding, Electroplating, Lithography and wet etching to develop MEMS products and focusing on collaborative R & D with industry and academia, support to Start-ups and skill development.
• Developed sensor based fault diagnosis module to using in finding machine faults in the shop floor to ensure effective machine health management.
• Mold less Polymer lens fabrication to convert smartphone into low cost handheld microscopy with variable magnification and upto 7 microns resolution.

Thesis/ Projects/ Interns Guided:

• Tech – 05
• Apprentice Trainee: 03
• Tech. Project Trainee: 02
• Interns: 10

Lecture Delivered/ Training Conducted:

• Invited talk on Microsystem packaging in Preconference workshop of MAMM conference organized by IIT Hyderabad during December 2022.
• Several skilling and reskilling programs, workshops, conferences, webinars including the hands-on sessions and in the areas for MEMS technology have been designed and conducted in association with my colleagues at CMTI.

• Megha Agrawal, Mahalakshmi S, Anila Puthoor, Varshini; Electroplated Copper Mask Based Glass Wet Etching for Development of Microfluidic Device’ Presentedin International conference on Micro, Nano and smart systems (IC-MNSS) 2024 organized by ISSS 2024 at IISc, Bangalore
• Rahul Achar A , Megha Agrawal, Anila Puthoor, Enhancing Fusion Bonding of Fused Silica through Surface Treatments: A Comparative Study, ICST-2023, Organized by BITS Pilani, Hyderabad Campus (published in IEEE Xplore ).
• Anila Puthoor, Megha Agrawal, Varshini, Koushik, Enhancement of glass micro-maching using Selective Electroplating , ICST-2023, Organized by BITS Pilani, Hyderabad Campus. (published in IEEE Xplore )
• Megha Agrawal, Harsha S, Anila Puthoor, Mahalakshmi S; Study on Electrochemical Deposition of Thick Copper Pillars For Wafer Level Integration; Presented in ICWEC-2023 organized by Electro-Chemical Society of India during April, 2023. (Under review for springer publication)
• TCS Nagarajesh,, Megha Agrawal ; Design and analysis of micro thermal mass flow sensor using thin-film-based thermocouples ; Presented in COPEN-2022 organized by IIT, Kanpur during December 2022
• Megha Agrawal, K. Neil Anand, Deepa R, Vidya Kumari;  Fabrication and characterisation of PDMS lenses for converting smartphone camera into handheld microscopy; Presented in MAMM-2022 organized by IIT, Hyderabad during December 2022.
• Megha Agrawal; Manohar, Bottumanchi Morish;  Kusuma N; Cu-Cu thermo compression wafer bonding techniques for micro-system integration, Indian Journal of Engineering and Materials Sciences, Vol 28, No.-2, pp. 142-15
• Megha Agrawal, Harsha S, Megha Agrawal; Study on Triple Stack Anodic Bonding Process for MEMS Applications; Presented in 5th International Conference on Emerging Electronics (IEEE-ICEEE 2020) Organized by Indian Institute of Technology Delhi, India.
• Sampada Naik, Harsha S, Megha Agrawal, Mahalakshmi S; Electrochemical deposition and Characterization of Copper Pillar Bumps – Application towards flip chip bonding; Presented in 5th International Conference on Emerging Electronics (IEEE-ICEEE 2020) Organized by  Indian Institute of Technology Delhi, and published by IEEE, Xplore
• Prardhan M, Megha Agrawal; “Low temperature Cu-Cu Thermo-compression bonding for Advanced Micro-system Packaging”, in proceeding of NCMST 2020 conference organized by CMTI, Bengaluru during March 2020. (Published in MTT Journal) by CMTI, Bengaluru  during March 2020. (Published in MTT Journal)
• Prabhat Ranjan, Harsha S, Megha Agrawal; “Development of signal conditioning system for biosensor applications” , in proceeding of NCMST 2020 conference organized by CMTI, Bengaluru  during March 2020. (Published in MTT Journal)
• Megha Agrawal, Sambhrama. M, “Wet Etching for Glass Micro-machining”, MTT Journal, Volume 18, Issue1, 2019, pp 11-14.
• N.Kusuma, Megha Agrawal, P.V.Shashikumar; “ Investigation on the Influences of Cutting Parameters on Machine Tool Vibration & Surface Roughness in High Precision CNC Milling Machine using MEMS Accelerometer” in proceeding of AIMTDR conference organized by IIT, Guhati during Dec 2014.
• Sarmistha Dhan, Megha Agrawal, C Ramachandra; “Characterization Method for Micro Beams based Pressure Transducers by Nanoindentation Technique”  in proceeding of ICMMM conference organized by IIT, Chennai during Aug 2014.
• Megha Agrawal, N.Kusuma, S.Usha, P.V.Shashikumar; Design and Development of Micro-Capacitive Pressure Sensor for Aerospace Applications“ in proceeding of ADMET Conference organized by Thapar University, Patiala during Feb 2014.
• Megha Agrawal, G.Anusha, N.Kusuma, P.V.Shashikumar; “Micro capacitive pressure sensor using PolyMUMPs Process“ in proceeding of mⁿf Conference organized by CMTI, Bangalore during Jan 2013.
• Anil K. Saini, Megha Agrawal; “A New Sub-1 Volt Reference for Low Voltage Application Based on MOSFET’s Threshold Voltage Extractor”   Journal of VLSI Design Tools and Technology , pp 14-19, Volume 3, Issue 1, 2013.
• Megha Agrawal, Nidhi Agrawal, Alpana Agarwal and Anil K. Saini, “Modeling of Ion-Sensitive Field Effect Transistor for pH Sensor using Verilog-A”, National Conference on Recent Advancement in Communication System & Image Processing (RACISP-2012) at BKBIET, Pilani, April 2012.
• Megha Agrawal, Anil K. Saini, Nidhi Agrawal and Alpana Agarwal, “Design of Read-Out Integrated Circuit for ISFET based pH sensor with On-Chip Temperature compensation for Biomedical Applications” National conference on VLSI Design and Embedded Systems (NCVDES-2011) at CEERI, Pilani in association with IETE, Oct 2011.
• Nidhi Agrawal, Anil K. Saini, Megha Agrawal and Alpana Agarwal, “A Low Power and High Resolution Track and Latch Comparator for Biomedical Application”, International conference on Advanced Electronics & Electrical Engineering (ICAEE-2011) MIT, Muradabad, Feb 2011.
• Megha Agrawal, Anil K. Saini, Nidhi Agrawal and Alpana Agarwal, “A Low Power Self Biased PMOS VT Extractor using Two Transistor Differential Amplifiers”, In proceeding of National conference on Recent trends in signal processing and VLSI design at GGITM, Bhopal in association with IEEE, Nov 2010, pp. 10 –12.