• Home
  • Mrs. Megha Agrawal

Mrs. Megha Agrawal

Designation: Scientist C
Centre: Centre for Sensors, Vision Technology and Controls (C-SVTC)
Group: MEMS and Sensors Group / Micro-Nano System Engineering Group
Joining Date: 11-05-2012
Email Id: megha[at]cmti[dot]res[dot]in
Office Telephone No: 080-22188216
Mobile No: 7999672688

  • Team member of project entitled Sensor Technology Development Facility (STDF).
  • Handling Photolithography, wet chemical process and wafer bonding Processes for MEMS fabrication and Packaging and R & D on the same.
  • Team member for development of Micro-flow sensor for drug delivery applications
  • MEMS Sensor Design and development

M. Tech (VLSI Design & CAD) from Thapar University, Patiala, India (2010) /M. Sc. (Electronics) from Banasthali University, Banasthali, India (2008)/B.Sc. from Jiwaji University, Gwalior, India (2006)

  • Design and development of MEMS sensors.
  • Wet chemical processes and photo-lithography for MEMS fabrication
  • Application of Wafer bonding for MEMS fabrication and 3-D micro-system integration.
  • ASIC design for Read out electronics of Micro-Sensors and integration.


  • Prardhan M, Megha Agrawal; “Low temperature Cu-Cu Thermo-compression bonding for Advanced Micro-system Packaging”, in proceeding of NCMST 2020 conference organized by CMTI, Bengaluru during March 2020.
  • Prabhat Ranjan, Harsha S, Megha Agrawal; “Development of signal conditioning system for biosensor applications” , in proceeding of NCMST 2020 conference organized by CMTI, Bengaluru during March 2020.
  • Megha Agrawal, Morish Manohar, Kusuma. N,” Review of Cu-Cu Thermocompression Wafer Bonding Techniques for Micro-System Integration”, Submitted to ISSS journal  (Under review)
  • Megha Agrawal, M, “Wet Etching for Glass Micromachining”,MTT Journal, Volume 18, Issue1, 2019, pp 11 14
  • Kusuma, Megha Agrawal, P.V.Shashikumar; “ Investigation on the Influences of Cutting Parameters on Machine Tool Vibration & Surface Roughness in High Precision CNC Milling Machine using MEMS Accelerometer” in proceeding of AIMTDR conference organized by IIT, Guhati during Dec 2014.
  • Sarmistha Dhan, Megha Agrawal, C Ramachandra; “Characterization Method for Micro Beams based Pressure Transducers by Nanoindentation Technique” in proceeding of ICMMM conference organized by IIT, Chennai during Aug 2014.
  • Megha Agrawal, N.Kusuma, S.Usha, P.V.Shashikumar; Design and Development of Micro-Capacitive Pressure Sensor for Aerospace Applications“ in proceeding of ADMET Conference organized by Thapar University, Patiala during Feb 2014.
  • Megha Agrawal, G.Anusha, N.Kusuma, P.V.Shashikumar; “Micro capacitive pressure sensor using PolyMUMPs Process“ in proceeding of mnf Conference organized by CMTI, Bangalore during Jan 2013.
  • Anil K. Saini, Megha Agrawal; “A New Sub-1 Volt Reference for Low Voltage Application Based on MOSFET’s Threshold Voltage Extractor” Journal of VLSI Design Tools and Technology , pp 14-19, Volume 3, Issue 1, 2013.
  • Megha Agrawal, Nidhi Agrawal, Alpana Agarwal and Anil K. Saini, “Modeling of Ion-Sensitive Field Effect Transistor for pH Sensor using Verilog-A”, National Conference on Recent Advancement in Communication System & Image Processing (RACISP-2012) at BKBIET, Pilani, April 2012.
  • Megha Agrawal, Anil K. Saini, Nidhi Agrawal and Alpana Agarwal, “Design of Read-Out Integrated Circuit for ISFET based pH sensor with On-Chip Temperature compensation for Biomedical Applications” National conference on VLSI Design and Embedded Systems (NCVDES-2011) at CEERI, Pilani in association with IETE, Oct 2011.
  • Nidhi Agrawal, Anil K. Saini, Megha Agrawal and Alpana Agarwal, “A Low Power and High Resolution Track and Latch Comparator for Biomedical Application”, International conference on Advanced Electronics & Electrical Engineering (ICAEE-2011) MIT, Muradabad, Feb 2011.
  • Megha Agrawal, Anil K. Saini, Nidhi Agrawal and Alpana Agarwal, “A Low Power Self Biased PMOS VT Extractor using Two Transistor Differential Amplifiers”, In proceeding of National conference on Recent trends in signal processing and VLSI design at GGITM, Bhopal in association with IEEE, Nov 2010, pp. 10 –12