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Sensor Technology Development Centre (STDC) is a one
of its kind national laboratory established with 6-inch wafer processing
capability and a dedicated focus on MEMS sensors, microsystems,
electronics, and semiconductor packaging. STDC houses 30+ process tools
catering to the fabrication, characterization, packaging, and validation
of devices and technologies. These process tools are housed inside
state-of-the-art cleanrooms with classifications of ISO-5(Class 100),
ISO-6(Class 1000), and ISO-7(Class 10000) as per the process demand over
a large area of around 1000 sq. meters. This facility is also backed up
with all the necessary utilities at the backend and the much-needed
ground vibration isolation to work at the feature sizes of micrometer
ranges.
The
major objectives of STDC include Research and Development in the field
of indigenous product & process knowledge creation for industry
needs, skilling & human resource development, the proliferation of
sensor-based systems/packages/solutions, support & service as a
Common Engineering Facility Centre for Capital Goods networking with
national & international industry/academia.
STDC
majorly focuses on activities viz., research and development of
innovative and new products such as sensors for machine tools,
automotive, space, aerospace, agriculture, biomedical, healthcare, etc.,
The centre also focuses on the development of technologies in
electronics, and semiconductor packaging such as dicing, bonding, thin
films, electroplating, sealing, wafer level packaging, 3D integration,
System in Package, etc.,
| Centre Head | |||
| Photo | Name | Designation | View Profile |
|---|---|---|---|
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Mrs. Kusuma N | Scientist - E | View Profile |
| Group Head | |||
| Photo | Name | Designation | View Profile |
|---|---|---|---|
|
Mr. Harsha S | Scientist - D | View Profile |
| Scientists | |||
| Photo | Name | Designation | View Profile |
|---|---|---|---|
|
|
Mr. Harsha S | Scientist - D | View Profile |
|
Mrs. Megha Agrawal | Scientist - D | View Profile |
|
Mr. Pradyumna J | Scientist - C | View Profile |
|
Mr. AJAY JASWAL | Scientist - B | View Profile |
|
Dr. Prabhanjan Kulkarni | Scientist - C | View Profile |
| Technical Staff | |||
| Photo | Name | Designation | Phone (Office) |
|---|---|---|---|
|
Mr. Prakash Devadiga | Senior Technical Assistant - I | 080-22188328 |
|
Mrs. Mahalakshmi S | Technical Assistant | 080-22188216 |
| Administration | |||
| Photo | Name | Designation | Phone (Office) |
|---|---|---|---|
| Sorry, No Staff are Matched Your Criteria. | |||
- Will be updated with appropriate information shortly
- Design and Development of Thin film based Temperature Sensor for Industrial and Defence applications
- Thermal based Micro-flow Sensor for drug delivery application
- Polymer device Development using Nano Imprint Lithography (NIL) process: Nano-gratings, Micro-needle array and micro-lens array , Micro fluidic channels, Micro Pillars
- Electron beam welding (EBW) Process Development
- Advanced packaging of RF MEMS switch: Carrier wafer Fabrication for RF switches using gold electroplating and photo-lithography
- Thermo-compression wafer bonding for advanced micro-system packaging:
- Silver wire bonding for micro-system Packaging.
- Technology establishment for Flip chip bonding
- MEMS design and Analysis
- Silicon and Polymer based Micro device / MEMs fabrication
- Signal conditioning circuit design for MEMS
- Characterization and Packaging of Micro-systems
- Inspection and testing of Packaged Micro-devices
- Internship and M.Tech Projects
Environment Test Chamber (Temperature and Humidity)
Make: XB-0TS-49
Specifications:
- Temperature Range: -40 to 1850C
- Humidity Range: 10 to 95% Rh
- Chamber Volume: 50 Lts
- Sample Load Capacity: 20 Kg
- Access Port: 4 inch opening with Silicone cork
Applications:
- Temperature Range: -40 to 1850C
- Humidity Range: 10 to 95% Rh
- Chamber Volume: 50 Lts
- Sample Load Capacity: 20 Kg
- Access Port: 4 inch opening with Silicone cork
X-Ray Inspection
Make: GE
Model: Xaminer
Specifications:
- Geometric Magnification = 2000x
- Can be detect down to 500nm
Applications:
- Non destructive test of MEMS Packages
- Inspection of defects in Dies, Wafers
- Inspection of PCB defects and casting parts
Helium Leak Detector
Make: Pfeiffer Vacuum
Model: Adixen ASM340
Specifications:
- Smallest detectable leak rate of 5 x 10-12 mbar l/s.
- Automatic calibration of leak detector with standard fine leak (NIST certified)
Applications:
- Fine leak inspection of hermetic sealing and qualification of seal.
- Bombing and vacuum inspection of sealed device, to qualify for MIL-STD-883 method 1014 for military and aero space applications.
- Sniffer inspection for fine leak detection
Bond Tester
Make: XYXTEC
Model: Condor Sigma
Specifications:
- Pull, push (10 kgf) and shear tests (100 kgf)
- Supports 80x magnification and fine pitch analysis
Applications:
- Mechanical characterization of die attach process
- Mechanical characterization of wire bonding process
Wafer Probe Station
Make: Everbeing
Model: EB-6
Specifications:
- 6” wafer inspection
- High resolution Micromanipulators – XYZ resolutions ≥ 80TPI
Applications:
- Electrical inspection of 6” wafer – KGD and quality inspection
- Failure analysis of devices
- Probing of I/O pads on devices from Front End Of Line (FEOL) and Mid End Of Line (MEOL)
Optical Microscope
Make: Leica
Model: DM8000M
Specifications:
- Various reflected light options like Bright field, dark field, Polarization, Differential Interference Contrast (DIC) and Fluorescence.
- Transmitted light options like bright field and polarization for inspection of transparent specimen like glass and certain polymers
Applications:
- Inspection, process control and defect analysis in MEMS packaging process
- Structural analysis of materials
Critical Point Drier
Make: Tousimis
Model: 915B-SERIES C
Specifications:
- Liquid CO2 based
- Suitable for wafer sizes upto 6” and small dies.
Applications:
- Drying of MEMS released structures.
- Drying of high aspect ratio micro structures.Sample preparation for SEM
E-Beam Welding
Make: EVOBEAM
Model: Evobeam Cube 200
Specifications:
- 6kW, 60kV electron beam gun.
- Twin gun configuration with horizontal gun to avoid sagging of long cylindrical jobs during welding
Applications:
- Vacuum hermetic sealing of microelectronic components.
- Military and aerospace applications where reliability of the system is important, Hermetic sealed micro electronics is essential.
- Micro joining and macro joining of dissimilar materials
N2 Seam Sealing
Make: Nippon Avionics
Model: NAWD- 1105D
Specifications:
- Resistive welding of different package size ranges from 3mm to 150mm.
- Multiple packages seam sealing in one fixture
Applications:
- N2 based hermetic seam sealing of micro electronics.
- Military and aerospace applications where reliability of the system is important, Hermetic sealed micro electronics is essential
Wire Bonder
Make: F&S Celvotec
Model: 56XX
Specifications:
- Semi-automatic wire bonder
- Performs Ball-wedge, wedge-wedge and deep access bonding
- Capable of Copper bonding
Applications:
- Au, Al, Cu wire bonding for MEMS
- Gold ball bumping
- Copper bonding
Wafer Bonder
Make: Suss Microtec
Model: SB6GEN2
Specifications:
- Wafer bonding of two or more wafers of size
- upto 6” and small dies.
- Suitable for Thermo-compression, Anodic,
- Fusion, Glass frit and Adhesive bonding
- Bonding force: upto 20 kN
- Temperature: upto 500°C with ± 2%
- Uniformity
Applications:
- Manufacturing of MEMS sensors
- Wafer level Packaging of MEMS sensors
- 3D packaging of MEMS+ASIC
Flip Chip Bonder
Make: Set
Model: FC150
Specifications:
-
- Thermo compression, reflow, eutectic, epoxy and Thermo sonic bonding capability
- Formic acid vapor tool configuration
- Autocollimator & Advanced Laser leveling system
- Fragile material compatibility
- Temperature up to 450 degree C
- Force range up to 100 kg
- Fine pitch bonding of 15 µm achieved
Applications:
- Multi chip modules
- Wireless multi stack chip bonding
Wafer Dicing system
Make: Disco
Model: DAD3240
Specifications:
- Sub-merged dicing for released structures
- Can dice 6 inch wafer
Applications:
- Dicing of released MEMS sensors
- Dicing of wafers and smaller dies
Plasma Cleaner/ Asher
Make: Plasma Etch
Model: PE50 XL
Specifications:
- Programmable process control 0 to 300 W,
- wide range RF power supply
Applications:
- Surface preparation for wire bonding and die attach process
- Contamination removal in the MEMS packaging process
Wet Chemical Benches
Model: FOUR-C-TRON
Specifications:
- NPP and SS perforated top with Laminar flow
Applications:
- Cleaning of Wafers/ die/ samples using different process.
- Etching of different materials.
- Photo-resist coating and its development
- Wafer cleaning and chemical processing
Electron Beam Evaporation System
Make: Kenosistec
Model: KE500EL
Specifications:
- 10 kW and 6 kW Twin gun configuration for co-evaporation.
- Chamber vacuum of up to 3×10-7 mbar
- Suitable for single wafer handling up to 6“
- Equipped with a grid less ion source and effusion cell
- Load lock and variable source to substrate distance from 500-700 mm
- Substrate heating up to 600 oC and max 30 rpm substrate rotation
Applications:
- Intermediate metal layer deposition in 3D packaging
- Optical coatings
- Insulating dielectrics deposition in fabrication and stacking approach
Deep Reactive Ion Etching (DRIE) System
Model: RIE-800iPB
Specifications:
- 6″ Wafer Processing
- Manual Wafer Loading, Automated Robot Transfer To Load-lock Chamber
- ESC With Active Wafer Temperature Control (Helium Backside Cooling)
- High-speed Gas Line System For Improved Response And Smoother Sidewalls
- Notch Prevention Package For SOI Applications
Applications:
- TSV formation for Advanced Micro-system Packaging
- High Aspect Ratio Micro-structures
Electroplating
Make: Fibro Tools Mu IKO
Model: LF Station
Specifications:
- Electroplating Station designed for MEMS/NANO and High density Interconnects.
- Dedicated Cu & Gold Plating Tanks. Suitable
to deposit any metal or alloy from aqueous solution. - Suitable for deposition on small sized dies (20mm X 20mm) and wafers upto 6″ Wafers
- Deposition Uniformity :>5% across the wafer
Applications:
- Gold, Copper Electroplating for MEMS devices
- Electrodes metallization
Hot Embossing Lithography (HEL)
Make: EV Group
Model: 501 HE
Specifications:
- Individually temperature controlled heaters with max 450oC.
- 20 KN force achieved with high degree of uniformity of pressure distribution.
- Pattern size up to 50nm
Applications:
- Polymer Micro needle array
- Polymer Micro fluidic channel
- Polymer Micro lens array
UV Nano Imprint Lithography (UV NIL)
Make: EV Group
Model: EVG610
Specifications:
- Wafer thickness ranging from 0.1 to 10mm can be handled upto to 6″ diameter.
- Can achieve feature size up to 50nm.
Applications:
- Polymer Micro Optics
- Polymer Micro fluidic channel
- Polymer Micro lens array
Spin Coater
Model: WS-650MZ-23Npp
Specifications:
- Wafer handling capacity: upto 6 inch
Applications:
- Spin coating of Photo resists, Polymers, Anti sticking coatings (ASL), Adhesives, Promoters
Double Side Mask Aligner
Make: Suss Micro
Model: MA6
Specifications:
- Handles wafers upto 6 inch
- Alignment accuracy = ± 1µm
- Performs bond alignment
Applications:
- photolithography for fabrication of MEMS devices
- Master mold creation for Nano Imprint Lithography
CMTI Logo created using Platinum 200nm layer
Inauguration of Sensor Technology Development Centre
Demonstration of Sensors Technology Developed at SVTC to Honorable Secretary, DHI, New Delhi
Signal Conditioning Module Developed at SVTC
Micro-Nano Gratings Developed at SVTC using Nano Imprint Technology
Micro Temperature Sensor Die (2.5 mm) Developed at SVTC
Micro Hole Array Developed at SVTC for Biomedical Application
National Conference on Microsystems Technologies (NCMST) 2020
Microsystems Packaging and Characterization Workshop 2018
Mrs. Kusuma N
Centre for Sensors, Vision Technology and IT
Central Manufacturing Technology Institute (CMTI)
Tumkur Road, Bengaluru - 560 022
Phone (Office): +91-80-22188349
Mobile: +91-9449842664
Fax: +91-80-23370428
Email: kusuma[at]cmti[dot]res[dot]in
Mr. Harsha S
Group Head for Sensor Technology Development Centre(STDC)
Central Manufacturing Technology Institute (CMTI)
Tumkur Road, Bengaluru - 560 022
Phone (Office): +91-80-22188323
Mobile:+91- 9449842665 / 9008420744
Fax: +91-80-23370428
Email: harsha[at]cmti[dot]res[dot]in